KM62256BLI-7L
vs
UPD43256BC-70L
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
RENESAS ELECTRONICS CORP
Package Description
DIP,
PLASTIC, DIP-28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PDIP-T
R-PDIP-T28
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
28
I/O Type
COMMON
JESD-609 Code
e0
Number of Terminals
28
Operating Temperature-Max
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Seated Height-Max
5.72 mm
Standby Current-Max
0.00005 A
Standby Voltage-Min
2 V
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare KM62256BLI-7L with alternatives
Compare UPD43256BC-70L with alternatives