KM616V1002CFI-12
vs
PDM31532LA12SOA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
IXYS CORP
Part Package Code
BGA
SOJ
Package Description
0.75 MM PITCH, FBGA-48
0.400 INCH, PLASTIC, SOJ-44
Pin Count
48
44
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
12 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B48
R-PDSO-J44
JESD-609 Code
e0
Length
7 mm
28.56 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
44
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX16
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
SOJ
Package Equivalence Code
BGA48,6X8,30
SOJ44,.44
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
3.76 mm
Standby Current-Max
0.005 A
Standby Voltage-Min
3 V
3.14 V
Supply Current-Max
0.095 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
J BEND
Terminal Pitch
0.75 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Width
6 mm
10.16 mm
Base Number Matches
1
1
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare KM616V1002CFI-12 with alternatives
Compare PDM31532LA12SOA with alternatives