KM616V1002CFI-12 vs SCM6323ATS12A feature comparison

KM616V1002CFI-12 Samsung Semiconductor

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SCM6323ATS12A Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MOTOROLA INC
Part Package Code BGA TSOP2
Package Description 0.75 MM PITCH, FBGA-48 TSOP2,
Pin Count 48 44
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-G44
JESD-609 Code e0 e0
Length 7 mm 18.41 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP2
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.005 A
Standby Voltage-Min 3 V
Supply Current-Max 0.095 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Width 6 mm 10.16 mm
Base Number Matches 1 2
Number of Ports 1
Output Enable YES

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