KM616FS1010AFI-7 vs SCM6323AYJ10AR feature comparison

KM616FS1010AFI-7 Samsung Semiconductor

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SCM6323AYJ10AR Freescale Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description TFBGA, BGA48,6X8,30
Pin Count 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 10 ns
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-J44
JESD-609 Code e0
Length 7 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1
Number of Terminals 48 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA SOJ
Package Equivalence Code BGA48,6X8,30 SOJ44,.44
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Standby Voltage-Min 1 V 3 V
Supply Current-Max 0.03 mA 0.15 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL J BEND
Terminal Pitch 0.75 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm
Base Number Matches 1 4
Standby Current-Max 0.005 A

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