KM44C1000CSLP-8
vs
MT4C4001JCN-10/XT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
End Of Life
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICROSS COMPONENTS
Part Package Code
DIP
DIP
Package Description
DIP, DIP20,.3
0.300 INCH, CERAMIC, DIP-20
Pin Count
20
20
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE
FAST PAGE
Access Time-Max
80 ns
100 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T20
R-CDIP-T20
JESD-609 Code
e0
e0
Length
24.56 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FAST PAGE DRAM
FAST PAGE DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
20
20
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1MX4
1MX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
1024
1024
Seated Height-Max
4.65 mm
5.08 mm
Self Refresh
NO
NO
Standby Current-Max
0.0001 A
0.002 A
Supply Current-Max
0.055 mA
0.065 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Compare KM44C1000CSLP-8 with alternatives
Compare MT4C4001JCN-10/XT with alternatives