KM4216C256-6 vs TMS55166-60DGH feature comparison

KM4216C256-6 Samsung Semiconductor

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TMS55166-60DGH Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC TEXAS INSTRUMENTS INC
Part Package Code SSOP SOIC
Package Description SSOP, SOP-64
Pin Count 64 64
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE WITH EDO FAST PAGE WITH EDO
Access Time-Max 60 ns 60 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN; 512 X 16 SAM PORT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT
JESD-30 Code R-PDSO-G64 R-PDSO-G64
Length 26.3 mm 26.295 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type VIDEO DRAM VIDEO DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 64 64
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.38 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Width 11.8 mm 12.04 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Output Characteristics 3-STATE
Package Equivalence Code SOP64,.54,32
Peak Reflow Temperature (Cel) NOT SPECIFIED
Refresh Cycles 512
Standby Current-Max 0.005 A
Supply Current-Max 0.225 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TMS55166-60DGH with alternatives