KM41C464P-10 vs HY53C464LS-10 feature comparison

KM41C464P-10 Samsung Semiconductor

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HY53C464LS-10 SK Hynix Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SK HYNIX INC
Part Package Code DIP DIP
Package Description PLASTIC, DIP-18 0.300 INCH, PLASTIC, DIP-18
Pin Count 18 18
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE FAST PAGE
Access Time-Max 100 ns 100 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T18 R-PDIP-T18
JESD-609 Code e0 e0
Length 22.96 mm 22.987 mm
Memory Density 262144 bit 262144 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX4 64KX4
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 256 256
Seated Height-Max 4.65 mm 4.699 mm
Standby Current-Max 0.001 A 0.001 A
Supply Current-Max 0.045 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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