KM41C256P-10 vs HYB41256-12 feature comparison

KM41C256P-10 Samsung Semiconductor

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HYB41256-12 Infineon Technologies AG

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INFINEON TECHNOLOGIES AG
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP-16
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE
Access Time-Max 100 ns 120 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 19.43 mm
Memory Density 262144 bit 262144 bit
Memory IC Type FAST PAGE DRAM PAGE MODE DRAM
Memory Width 1 1
Number of Functions 1
Number of Ports 1
Number of Terminals 16 16
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 256 256
Seated Height-Max 4.65 mm
Supply Current-Max 0.045 mA 0.075 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2

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