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KM41256-15P vs MCM6256BP15 feature comparison

KM41256-15P Samsung Semiconductor

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MCM6256BP15 Freescale Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Time-Max 150 ns 150 ns
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type PAGE MODE DRAM PAGE MODE DRAM
Memory Width 1 1
Moisture Sensitivity Level 3
Number of Terminals 16 16
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 256 256
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology MOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 3
Power Supplies 5 V
Supply Current-Max 0.065 mA
Memory » DRAMs
Memory » DRAMs

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