KM28C64-25
vs
MBM28C64-25P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
FUJITSU LTD
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
250 ns
250 ns
Additional Feature
AUTOMATIC WRITE; 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS
Data Retention Time-Min
10
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX8
8KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.59 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
2
Rohs Code
Command User Interface
NO
Data Polling
YES
JESD-609 Code
e0
Package Equivalence Code
DIP28,.6
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Toggle Bit
NO
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