KM28C256-25
vs
28C256-25/D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.6
0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
250 ns
250 ns
Command User Interface
NO
NO
Data Polling
YES
YES
Endurance
10000 Write/Erase Cycles
10000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T28
R-CDIP-T28
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Page Size
64 words
64 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.59 mm
4.064 mm
Standby Current-Max
0.0001 A
0.001 A
Supply Current-Max
0.06 mA
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
YES
Width
15.24 mm
15.24 mm
Write Cycle Time-Max (tWC)
5 ms
2 ms
Base Number Matches
1
1
Additional Feature
AUTOMATIC WRITE
Length
35.56 mm
Compare KM28C256-25 with alternatives
Compare 28C256-25/D with alternatives