KM28C256-20 vs X28C256D-20 feature comparison

KM28C256-20 Samsung Semiconductor

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X28C256D-20 Xicor Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC XICOR INC
Part Package Code DIP
Package Description PLASTIC, DIP-28 DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 200 ns 200 ns
Command User Interface NO NO
Data Polling YES YES
Endurance 10000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Page Size 64 words 64 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.59 mm 5.9 mm
Standby Current-Max 0.0001 A 0.0005 A
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Toggle Bit YES YES
Width 15.24 mm 15.24 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Base Number Matches 1 1
Additional Feature 100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
Data Retention Time-Min 100
Length 37.15 mm
Screening Level MIL-STD-883

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