KIC7WZ04FK
vs
74LVC3G06DC,125
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
KEC CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
SSOP
Package Description
US-8
2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
2.3 mm
2.3 mm
Logic IC Type
INVERTER
INVERTER
Number of Functions
3
3
Number of Inputs
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
VSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
10 ns
8.2 ns
Seated Height-Max
0.9 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
2 mm
2 mm
Base Number Matches
1
2
Rohs Code
Yes
Manufacturer Package Code
SOT765-1
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Moisture Sensitivity Level
1
Output Characteristics
OPEN-DRAIN
Package Equivalence Code
TSSOP8,.12,20
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Schmitt Trigger
NO
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
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