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KFG1G16U2C-DIB60 vs S29JL064H55BFI003 feature comparison

KFG1G16U2C-DIB60 Samsung Semiconductor

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S29JL064H55BFI003 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SPANSION INC
Part Package Code BGA BGA
Package Description VFBGA, BGA63,10X12,32 12 X 11 MM, LEAD FREE, FPBGA-63
Pin Count 63 63
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 76 ns 55 ns
Command User Interface YES YES
Data Polling NO YES
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 13 mm 12 mm
Memory Density 1073741824 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 1K 16,126
Number of Terminals 63 63
Number of Words 67108864 words 4194304 words
Number of Words Code 64000000 4000000
Operating Mode SYNCHRONOUS/ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Equivalence Code BGA63,10X12,32 BGA63,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Page Size 1K words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Programming Voltage 3.3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1 mm 1.2 mm
Sector Size 64K 8K,64K
Standby Current-Max 0.00008 A 0.000005 A
Supply Current-Max 0.065 mA 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Toggle Bit NO YES
Type SLC NAND TYPE NOR TYPE
Width 10 mm 11 mm
Base Number Matches 1 3
Alternate Memory Width 8
Boot Block BOTTOM/TOP
Common Flash Interface YES
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER
Memory » Flash Memories
Memory » Flash Memories

Compare KFG1G16U2C-DIB60 with alternatives

Compare S29JL064H55BFI003 with alternatives