KFG1G16Q2C-DEB60
vs
NAND01GR4A0CZA1T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
VFBGA, BGA63,10X12,32
BGA,
Pin Count
63
63
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
76 ns
15000 ns
Boot Block
BOTTOM
Clock Frequency-Max (fCLK)
66 MHz
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Length
13 mm
Memory Density
17179869184 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Sectors/Size
1K
Number of Terminals
63
63
Number of Words
1073741824 words
67108864 words
Number of Words Code
1000000000
64000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-30 °C
Organization
1GX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
BGA
Package Equivalence Code
BGA63,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY
Page Size
1K words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1 mm
Sector Size
64K
Standby Current-Max
0.00005 A
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
SLC NAND TYPE
Width
10 mm
Write Cycle Time-Max (tWC)
0.00007 ms
Base Number Matches
1
2
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare KFG1G16Q2C-DEB60 with alternatives
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