KD82750DB-45 vs UPD72123R feature comparison

KD82750DB-45 Intel Corporation

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UPD72123R NEC Electronics America Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP NEC ELECTRONICS AMERICA INC
Part Package Code QFP
Package Description BQFP, PGA,
Pin Count 132
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.3
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 45 MHz 4 MHz
External Data Bus Width 32 8
JESD-30 Code S-PQFP-G132 S-CPGA-P132
JESD-609 Code e0
Length 24.13 mm 35.56 mm
Maximum Num of Bits per Pixel 32 4
Number of Terminals 132 132
Operating Temperature-Max 95 °C 70 °C
Operating Temperature-Min -10 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code BQFP PGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, BUMPER GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.57 mm
Supply Current-Max 375 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form GULL WING PIN/PEG
Terminal Pitch 0.635 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Width 24.13 mm 35.56 mm
uPs/uCs/Peripheral ICs Type GRAPHICS PROCESSOR GRAPHICS PROCESSOR
Base Number Matches 1 1

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