KD82750DB-45 vs KD82750DB-28 feature comparison

KD82750DB-45 Intel Corporation

Buy Now Datasheet

KD82750DB-28 Intel Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code QFP QFP
Package Description BQFP, BQFP,
Pin Count 132 132
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.3
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 45 MHz 28 MHz
External Data Bus Width 32 32
JESD-30 Code S-PQFP-G132 S-PQFP-G132
JESD-609 Code e0 e0
Length 24.13 mm 24.13 mm
Maximum Num of Bits per Pixel 32 32
Number of Terminals 132 132
Operating Temperature-Max 95 °C 95 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BQFP BQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, BUMPER FLATPACK, BUMPER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Supply Current-Max 375 mA 375 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position QUAD QUAD
Width 24.13 mm 24.13 mm
uPs/uCs/Peripheral ICs Type GRAPHICS PROCESSOR GRAPHICS PROCESSOR
Base Number Matches 1 1

Compare KD82750DB-45 with alternatives

Compare KD82750DB-28 with alternatives