KBPC802G
vs
KBPC802-G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
DEAN TECHNOLOGY INC
SANGDEST MICROELECTRONICS (NANJING) CO LTD
Package Description
S-XBFM-W4
S-PUFM-W4
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.80
Breakdown Voltage-Min
200 V
200 V
Case Connection
ISOLATED
ISOLATED
Configuration
BRIDGE, 4 ELEMENTS
BRIDGE, 4 ELEMENTS
Diode Element Material
SILICON
SILICON
Diode Type
BRIDGE RECTIFIER DIODE
BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF)
1.1 V
1.1 V
JESD-30 Code
S-XBFM-W4
S-PUFM-W4
Non-rep Pk Forward Current-Max
200 A
125 A
Number of Elements
4
4
Number of Phases
1
1
Number of Terminals
4
4
Output Current-Max
8 A
8 A
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Shape
SQUARE
SQUARE
Package Style
FLANGE MOUNT
FLANGE MOUNT
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
200 V
200 V
Reverse Current-Max
0.000005 µA
Surface Mount
NO
NO
Terminal Form
WIRE
WIRE
Terminal Position
BOTTOM
UPPER
Base Number Matches
8
2
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reference Standard
UL RECOGNIZED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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