KA358D
vs
LM358DR2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
SOIC
Package Description
0.225 INCH, SOP-8
SOP, SOP8,.25
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.5 µA
Bias Current-Max (IIB) @25C
0.25 µA
Common-mode Reject Ratio-Nom
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
9000 µV
9000 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.9 mm
Low-Offset
NO
NO
Neg Supply Voltage Limit-Max
-16 V
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.95 mm
Supply Current-Max
2 mA
Supply Voltage Limit-Max
16 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Voltage Gain-Min
15000
Width
3.9 mm
Base Number Matches
3
5
Rohs Code
JESD-609 Code
e0
Packing Method
TAPE AND REEL
Power Supplies
+-1.5/+-15/3/30 V
Terminal Finish
Tin/Lead (Sn/Pb)
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