KA3525AN
vs
UC2525BQ
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP, DIP16,.3
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
20
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
35 V
|
35 V
|
| Input Voltage-Min |
8 V
|
8 V
|
| Input Voltage-Nom |
20 V
|
20 V
|
| JESD-30 Code |
R-PDIP-T16
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
|
| Length |
19.4 mm
|
8.965 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Current-Max |
0.1 A
|
0.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP16,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.31 mm
|
4.57 mm
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
| Switching Frequency-Max |
430 kHz
|
500 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
8.965 mm
|
| Base Number Matches |
3
|
2
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare UC2525BQ with alternatives