KA3525AN
vs
SG2525AP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
STMICROELECTRONICS
Part Package Code
DIP
SOIC
Package Description
DIP, DIP16,.3
SO-16
Pin Count
16
16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SWITCHING CONTROLLER
SWITCHING CONTROLLER
Control Mode
VOLTAGE-MODE
VOLTAGE-MODE
Control Technique
PULSE WIDTH MODULATION
PULSE WIDTH MODULATION
Input Voltage-Max
35 V
35 V
Input Voltage-Min
8 V
8 V
Input Voltage-Nom
20 V
20 V
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e4
Length
19.4 mm
9.9 mm
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-25 °C
Output Current-Max
0.1 A
0.5 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SO16(UNSPEC)
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.31 mm
1.75 mm
Surface Mount
NO
YES
Switcher Configuration
PUSH-PULL
PUSH-PULL
Switching Frequency-Max
430 kHz
500 kHz
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
3
1
Samacsys Manufacturer
STMicroelectronics
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
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