KA2134
vs
TDA2579B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP18,.3
|
DIP, DIP18,.3
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Application |
TV
|
TV
|
| Blanking Output |
NO
|
YES
|
| Consumer IC Type |
HORIZ/VERT DEFLECTION IC
|
HORIZ/VERT DEFLECTION IC
|
| JESD-30 Code |
R-PDIP-T18
|
R-PDIP-T18
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
18
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP18,.3
|
DIP18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Length |
|
21.6 mm
|
| Moisture Sensitivity Level |
|
1
|
| Seated Height-Max |
|
4.7 mm
|
| Supply Current-Max |
|
85 mA
|
| Supply Voltage-Max (Vsup) |
|
13.2 V
|
| Supply Voltage-Min (Vsup) |
|
10 V
|
| Width |
|
7.62 mm
|
|
|
|
Compare KA2134 with alternatives
Compare TDA2579B with alternatives