KA2131
vs
TDA8359J/N2,112
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SFM
|
ZIP
|
| Package Description |
, SIP9,.1TB
|
ZIP,
|
| Pin Count |
9
|
9
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Application |
TV
|
TV
|
| Blanking Output |
YES
|
NO
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PSFM-T9
|
R-PZIP-T9
|
| JESD-609 Code |
e0
|
e3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SIP9,.1TB
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
24 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
24 V
|
7.5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BCDMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
SINGLE
|
ZIG-ZAG
|
| Base Number Matches |
1
|
1
|
| Length |
|
13 mm
|
| Package Code |
|
ZIP
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
21.4 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
2.5 mm
|
|
|
|
Compare KA2131 with alternatives
Compare TDA8359J/N2,112 with alternatives