K9K2G08R0A-JIB00
vs
NAND02GR3B2CN6E
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NUMONYX
|
| Part Package Code |
BGA
|
TSOP
|
| Package Description |
TFBGA, BGA63,10X12,32
|
TSSOP, TSSOP48,.8,20
|
| Pin Count |
63
|
48
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
30 ns
|
25000 ns
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
NO
|
NO
|
| JESD-30 Code |
R-PBGA-B63
|
R-PDSO-G48
|
| JESD-609 Code |
e1
|
|
| Length |
12 mm
|
18.4 mm
|
| Memory Density |
2147483648 bit
|
2147483648 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
2K
|
2K
|
| Number of Terminals |
63
|
48
|
| Number of Words |
268435456 words
|
268435456 words
|
| Number of Words Code |
256000000
|
256000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256MX8
|
256MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TSSOP
|
| Package Equivalence Code |
BGA63,10X12,32
|
TSSOP48,.8,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Page Size |
2K words
|
2K words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Programming Voltage |
1.8 V
|
1.8 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Sector Size |
128K
|
128K
|
| Standby Current-Max |
0.0001 A
|
0.00005 A
|
| Supply Current-Max |
0.03 mA
|
0.015 mA
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Toggle Bit |
NO
|
NO
|
| Type |
SLC NAND TYPE
|
SLC NAND TYPE
|
| Width |
9.5 mm
|
12 mm
|
| Base Number Matches |
1
|
3
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare K9K2G08R0A-JIB00 with alternatives
Compare NAND02GR3B2CN6E with alternatives