K9F5608U0C-VIB0T
vs
K9F5608U0A-YCB00
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Package Description
TSSOP, TSSOP48,.71,20
TSOP1,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
30 ns
35 ns
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Memory Density
268435456 bit
268435456 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Sectors/Size
2K
Number of Terminals
48
48
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32MX8
32MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSOP1
Package Equivalence Code
TSSOP48,.71,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Page Size
512 words
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Sector Size
16K
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
NO
Base Number Matches
1
1
Part Package Code
TSOP1
Pin Count
48
Additional Feature
CONTAINS ADDITIONAL 1M X 8 BIT NAND FLASH
Length
18.4 mm
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Programming Voltage
2.7 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Width
12 mm
Compare K9F5608U0C-VIB0T with alternatives
Compare K9F5608U0A-YCB00 with alternatives