K9F5608U0C-PIB0
vs
K9F5608U0C-YCB0T
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
30 ns
|
30 ns
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
NO
|
NO
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Sectors/Size |
2K
|
2K
|
| Number of Terminals |
48
|
48
|
| Number of Words |
33554432 words
|
33554432 words
|
| Number of Words Code |
32000000
|
32000000
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
32MX8
|
32MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP48,.8,20
|
TSSOP48,.8,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Page Size |
512 words
|
512 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Sector Size |
16K
|
16K
|
| Standby Current-Max |
0.00005 A
|
0.00005 A
|
| Supply Current-Max |
0.025 mA
|
0.02 mA
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Toggle Bit |
NO
|
NO
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
TSSOP, TSSOP48,.8,20
|
|
|
|
Compare K9F5608U0C-PIB0 with alternatives
Compare K9F5608U0C-YCB0T with alternatives