K9F2G08U0M-PCB0T
vs
MT29F2G16AABWPXXXXET
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MICRON TECHNOLOGY INC
|
Part Package Code |
TSOP1
|
TSOP1
|
Package Description |
12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
|
TSOP1,
|
Pin Count |
48
|
48
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
30 ns
|
|
Additional Feature |
CONTAINS ADDITIONAL 64M BIT NAND FLASH
|
|
Command User Interface |
YES
|
|
Data Polling |
NO
|
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
JESD-609 Code |
e6
|
e3
|
Length |
18.4 mm
|
18.4 mm
|
Memory Density |
2147483648 bit
|
2147483648 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
16
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
2K
|
|
Number of Terminals |
48
|
48
|
Number of Words |
268435456 words
|
134217728 words
|
Number of Words Code |
256000000
|
128000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
256MX8
|
128MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP1
|
TSOP1
|
Package Equivalence Code |
TSSOP48,.8,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
Page Size |
2K words
|
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
2.7 V
|
2.7 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Sector Size |
128K
|
|
Standby Current-Max |
0.00005 A
|
|
Supply Current-Max |
0.03 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN BISMUTH
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Toggle Bit |
NO
|
|
Type |
SLC NAND TYPE
|
SLC NAND TYPE
|
Width |
12 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare K9F2G08U0M-PCB0T with alternatives
Compare MT29F2G16AABWPXXXXET with alternatives