K9F2808U0B-YCB0
vs
K9F2808U0A-YCB0
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP1
TSOP1
Package Description
12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
35 ns
Additional Feature
CONTAINS ADDITIONAL 512K X 8 BIT NAND FLASH
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e0
Length
18.4 mm
18.4 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
1K
Number of Terminals
48
48
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX8
16MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Page Size
512 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
16K
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
NO
Type
SLC NAND TYPE
SLC NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
1
Compare K9F2808U0B-YCB0 with alternatives
Compare K9F2808U0A-YCB0 with alternatives