K9F1208Q0B-HCB00 vs K9F1208Q0B-DIB0 feature comparison

K9F1208Q0B-HCB00 Samsung Semiconductor

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K9F1208Q0B-DIB0 Samsung Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description VFBGA, FBGA, BGA63,10X12,32
Pin Count 63
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 35 ns 35 ns
Additional Feature CONTAINS ADDITIONAL 16M BIT SPARE MEMORY
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e1
Length 13 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 2
Number of Functions 1
Number of Terminals 63 63
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64MX8 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA FBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.9 mm
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8.5 mm
Base Number Matches 1 1
Command User Interface YES
Data Polling NO
Number of Sectors/Size 4K
Package Equivalence Code BGA63,10X12,32
Page Size 512 words
Ready/Busy YES
Sector Size 16K
Standby Current-Max 0.00005 A
Supply Current-Max 0.015 mA
Toggle Bit NO

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