K9F1208D0B-HIB0
vs
K9K1208D0C-JIB00
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Package Description
FBGA, BGA63,10X12,32
TFBGA, BGA63,10X12,32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
30 ns
30 ns
Command User Interface
YES
YES
Data Polling
NO
NO
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Sectors/Size
4K
4K
Number of Terminals
63
63
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX8
64MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA63,10X12,32
BGA63,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Page Size
512 words
512 words
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Sector Size
16K
16K
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Nom (Vsup)
2.65 V
2.65 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
NO
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
63
JESD-609 Code
e1
Length
11 mm
Moisture Sensitivity Level
3
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.7 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
2.9 V
Supply Voltage-Min (Vsup)
2.4 V
Terminal Finish
TIN SILVER COPPER
Width
9 mm
Compare K9F1208D0B-HIB0 with alternatives
Compare K9K1208D0C-JIB00 with alternatives