K8S1315EZC-FE1FT vs K8S1015EZC-DE1DT feature comparison

K8S1315EZC-FE1FT Samsung Semiconductor

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K8S1015EZC-DE1DT Samsung Semiconductor

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA64,10X14,20 FBGA, BGA64,10X14,20
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.B.1 3A991.B.1.B.1
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 95 ns 95 ns
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Memory Density 536870912 bit 536870912 bit
Memory IC Type EEPROM CARD EEPROM CARD
Memory Width 16 16
Moisture Sensitivity Level 1 1
Number of Sectors/Size 512 512
Number of Terminals 64 64
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 32MX16 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA64,10X14,20 BGA64,10X14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Sector Size 64K 64K
Standby Current-Max 0.00003 A 0.00003 A
Supply Current-Max 0.07 mA 0.07 mA
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
JESD-609 Code e3
Terminal Finish MATTE TIN

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Compare K8S1015EZC-DE1DT with alternatives