K8S1315EZC-FE1D0 vs S29GL01GP13FACR13 feature comparison

K8S1315EZC-FE1D0 Samsung Semiconductor

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S29GL01GP13FACR13 Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description VFBGA, 13 X 11 MM, 1 MM PITCH, FBGA-64
Pin Count 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 130 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Memory Density 536870912 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 1
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 33554432 words 1073741824 words
Number of Words Code 32000000 1000000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C
Organization 32MX16 1GX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 3 V
Seated Height-Max 1 mm 1.4 mm
Supply Current-Max 0.07 mA 0.11 mA
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 3 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
Rohs Code No
Length 13 mm
Qualification Status Not Qualified
Width 11 mm

Compare K8S1315EZC-FE1D0 with alternatives

Compare S29GL01GP13FACR13 with alternatives