K8S1215EZC-SC1C0
vs
RC48F4400P0VB0EJ
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MICRON TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
VFBGA, BGA64,10X14,20
|
BGA-64
|
Pin Count |
64
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
100 ns
|
17 ns
|
Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
IT ALSO HAVE ASYNCHRONOUS OPERATING MODE
|
Boot Block |
BOTTOM/TOP
|
BOTTOM/TOP
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
YES
|
Data Polling |
YES
|
NO
|
JESD-30 Code |
R-PBGA-B64
|
R-PBGA-B64
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
512
|
8, 510
|
Number of Terminals |
64
|
64
|
Number of Words |
33554432 words
|
33554432 words
|
Number of Words Code |
32000000
|
32000000
|
Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
32MX16
|
32MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
TBGA
|
Package Equivalence Code |
BGA64,10X14,20
|
BGA64,8X8,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
235
|
Programming Voltage |
1.8 V
|
1.8 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Sector Size |
64K
|
16K,64K
|
Standby Current-Max |
0.00003 A
|
0.00042 A
|
Supply Current-Max |
0.07 mA
|
0.031 mA
|
Supply Voltage-Max (Vsup) |
1.95 V
|
2 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Toggle Bit |
YES
|
NO
|
Type |
NOR TYPE
|
NOR TYPE
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Length |
|
13 mm
|
Terminal Finish |
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
Width |
|
10 mm
|
|
|
|
Compare K8S1215EZC-SC1C0 with alternatives
Compare RC48F4400P0VB0EJ with alternatives