K8S1015EZC-DE1DT vs K8S1115EZC-FE1ET feature comparison

K8S1015EZC-DE1DT Samsung Semiconductor

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K8S1115EZC-FE1ET Samsung Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA64,10X14,20 FBGA, BGA64,10X14,20
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.B.1 3A991.B.1.B.1
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 95 ns 95 ns
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e3
Memory Density 536870912 bit 536870912 bit
Memory IC Type EEPROM CARD EEPROM CARD
Memory Width 16 16
Moisture Sensitivity Level 1 1
Number of Sectors/Size 512 512
Number of Terminals 64 64
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 32MX16 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA64,10X14,20 BGA64,10X14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Sector Size 64K 64K
Standby Current-Max 0.00003 A 0.00003 A
Supply Current-Max 0.07 mA 0.07 mA
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish MATTE TIN
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Base Number Matches 1 1

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Compare K8S1115EZC-FE1ET with alternatives