K8S1015ETC-SE1DT vs WED7G128ATA33XDC25 feature comparison

K8S1015ETC-SE1DT Samsung Semiconductor

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WED7G128ATA33XDC25 Microsemi Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICROSEMI CORP
Package Description FBGA, BGA64,10X14,20 DIMM,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.B.1 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 95 ns
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B64 R-XDMA-N144
JESD-609 Code e3
Memory Density 536870912 bit 1073741824 bit
Memory IC Type EEPROM CARD FLASH MODULE
Memory Width 16 16
Moisture Sensitivity Level 1
Number of Sectors/Size 4,511
Number of Terminals 64 144
Number of Words 33554432 words 67108864 words
Number of Words Code 32000000 64000000
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -25 °C
Organization 32MX16 64MX16
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code FBGA DIMM
Package Equivalence Code BGA64,10X14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 3.3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Sector Size 16K,64K
Standby Current-Max 0.00003 A
Supply Current-Max 0.07 mA
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form BALL NO LEAD
Terminal Pitch 0.5 mm
Terminal Position BOTTOM DUAL
Toggle Bit YES
Type NOR TYPE
Base Number Matches 1 1
Part Package Code MODULE
Pin Count 144
Additional Feature CAN ALSO OPERATE WITH A 5V SUPPLY
Number of Functions 1
Operating Mode ASYNCHRONOUS
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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