K8D3216UTCFC0700
vs
SST39VF3202-70-4C-B3K
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
6 X 8.5 MM, 0.80 MM PITCH, FBGA-48
6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
Boot Block
TOP
TOP
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8.5 mm
8 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
1
1
Rohs Code
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-609 Code
e0
Number of Sectors/Size
1K
Package Equivalence Code
BGA48,6X8,32
Peak Reflow Temperature (Cel)
240
Sector Size
2K
Standby Current-Max
0.00002 A
Supply Current-Max
0.035 mA
Terminal Finish
TIN LEAD
Toggle Bit
YES
Compare K8D3216UTCFC0700 with alternatives
Compare SST39VF3202-70-4C-B3K with alternatives