K8A6515EBC-SE7E0 vs GE28F128W18T90 feature comparison

K8A6515EBC-SE7E0 Samsung Semiconductor

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GE28F128W18T90 Numonyx Memory Solutions

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC NUMONYX
Part Package Code BGA BGA
Package Description TFBGA, 0.75 MM PITCH, VFBGA-56
Pin Count 88 56
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 90 ns
Additional Feature BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE ALSO SUPPORTS SYNCHRONOUS OPERATION
Boot Block BOTTOM TOP
JESD-30 Code R-PBGA-B88 R-PBGA-B56
Length 11 mm 9 mm
Memory Density 67108864 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 88 56
Number of Words 4194304 words 8388608 words
Number of Words Code 4000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 4MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1 mm
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 8 mm 7.7 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

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Compare GE28F128W18T90 with alternatives