K7R643684M-FC25T
vs
GS8662D36BGD-250
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
GSI TECHNOLOGY
Package Description
BGA, BGA165,11X15,40
LBGA, BGA165,11X15,40
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Clock Frequency-Max (fCLK)
250 MHz
250 MHz
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
e1
Memory Density
75497472 bit
75497472 bit
Memory IC Type
STANDARD SRAM
QDR SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX36
2MX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA165,11X15,40
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
1.7 V
1.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
165
Factory Lead Time
24 Weeks
Additional Feature
PIPELINED ARCHITECTURE
Length
15 mm
Number of Functions
1
Seated Height-Max
1.4 mm
Supply Current-Max
0.73 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Width
13 mm
Compare K7R643684M-FC25T with alternatives
Compare GS8662D36BGD-250 with alternatives