K7R643684M-FC20T
vs
CY7C1515V18-200BZC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Package Description
BGA, BGA165,11X15,40
15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
e0
Memory Density
75497472 bit
75497472 bit
Memory IC Type
STANDARD SRAM
QDR SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX36
2MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
COMMERCIAL
Standby Voltage-Min
1.7 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
2
Part Package Code
BGA
Pin Count
165
Additional Feature
PIPELINED ARCHITECTURE
Length
17 mm
Number of Functions
1
Peak Reflow Temperature (Cel)
220
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
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