K7R641882M-FI25
vs
K7R641882M-FI25T
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG SEMICONDUCTOR INC
|
Package Description |
BGA, BGA165,11X15,40
|
BGA, BGA165,11X15,40
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
0.45 ns
|
0.45 ns
|
Clock Frequency-Max (fCLK) |
166 MHz
|
166 MHz
|
I/O Type |
SEPARATE
|
SEPARATE
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
JESD-609 Code |
e1
|
e1
|
Memory Density |
75497472 bit
|
75497472 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
18
|
18
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
165
|
165
|
Number of Words |
4194304 words
|
4194304 words
|
Number of Words Code |
4000000
|
4000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
4MX18
|
4MX18
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA165,11X15,40
|
BGA165,11X15,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Voltage-Min |
1.7 V
|
1.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
1
|
|
|
|
Compare K7R641882M-FI25 with alternatives
Compare K7R641882M-FI25T with alternatives