K7P323666M-HC250 vs GS832436B-150 feature comparison

K7P323666M-HC250 Samsung Semiconductor

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GS832436B-150 GSI Technology

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 119 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2 ns 10 ns
Additional Feature PIPELINED ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 22 mm 22 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type LATE-WRITE SRAM CACHE SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX36 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.21 mm 1.99 mm
Supply Voltage-Max (Vsup) 2.63 V 2.7 V
Supply Voltage-Min (Vsup) 2.37 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220
Terminal Finish TIN LEAD

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Compare GS832436B-150 with alternatives