K7N401801B-QI16 vs 71V3558XS166PFGI feature comparison

K7N401801B-QI16 Samsung Semiconductor

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71V3558XS166PFGI Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description 20 X 14 MM, TQFP-100 LQFP, QFP100,.63X.87
Pin Count 100 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 3.5 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz 166 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e3
Length 20 mm 20 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX18 256KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP100,.63X.87 QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Standby Current-Max 0.05 A 0.045 A
Standby Voltage-Min 3.14 V 3.14 V
Supply Current-Max 0.29 mA 0.36 mA
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Matte Tin (Sn) - annealed
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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