K7M323625M-QC65
vs
AS7C251MPFD36A-166TQCN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
LQFP, QFP100,.63X.87
LQFP,
Pin Count
100
100
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
3.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
e3
Length
20 mm
20 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
ZBT SRAM
STANDARD SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX36
1MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.1 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.31 mA
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
1
2
Compare K7M323625M-QC65 with alternatives
Compare AS7C251MPFD36A-166TQCN with alternatives