K7D161888B-HC300 vs IBM041816CBLBC-27 feature comparison

K7D161888B-HC300 Samsung Semiconductor

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IBM041816CBLBC-27 IBM

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description BGA, BGA, BGA153,9X17,50
Pin Count 153 153
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.2 ns 2 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B153 R-PBGA-B153
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 153 153
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 1MX18 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.21 mm 2.679 mm
Supply Voltage-Max (Vsup) 1.9 V 2.625 V
Supply Voltage-Min (Vsup) 1.7 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 370 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA153,9X17,50
Standby Current-Max 0.2 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.515 mA

Compare K7D161888B-HC300 with alternatives

Compare IBM041816CBLBC-27 with alternatives