K6X8016T3B-TF70 vs K6F8016V3A-TF700 feature comparison

K6X8016T3B-TF70 Samsung Semiconductor

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K6F8016V3A-TF700 Samsung Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Package Description TSOP, TSOP44,.46,32 TSOP2,
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Terminals 44 44
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP TSOP2
Package Equivalence Code TSOP44,.46,32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.000015 A
Standby Voltage-Min 1.5 V
Supply Current-Max 0.045 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code TSOP2
Pin Count 44
Length 18.4 mm
Number of Functions 1
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Width 10.16 mm

Compare K6X8016T3B-TF70 with alternatives

Compare K6F8016V3A-TF700 with alternatives