K6X8008C2B-UF550 vs CY14B108L-ZS25XIT feature comparison

K6X8008C2B-UF550 Samsung Semiconductor

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CY14B108L-ZS25XIT Infineon Technologies AG

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INFINEON TECHNOLOGIES AG
Part Package Code TSOP2
Package Description TSOP2, TSOP2-44
Pin Count 44
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 55 ns 25 ns
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e6 e3
Length 18.41 mm 18.415 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM NON-VOLATILE SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.194 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN BISMUTH Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 1 2
Package Equivalence Code TSOP44,.46,32
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.01 A
Supply Current-Max 0.075 mA
Time@Peak Reflow Temperature-Max (s) 40

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