K6X1008C2D-PF55T00 vs K6X1008C2D-PF550 feature comparison

K6X1008C2D-PF55T00 Samsung Semiconductor

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K6X1008C2D-PF550 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP1 TSOP1
Package Description 8 X 20 MM, LEAD FREE, TSOP1-32 8 X 20 MM, LEAD FREE, TSOP1-32
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
Length 18.4 mm 18.4 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 8 mm 8 mm
Base Number Matches 1 1
Rohs Code Yes
I/O Type COMMON
Moisture Sensitivity Level 2
Output Characteristics 3-STATE
Package Equivalence Code TSSOP32,.8,20
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.00001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.025 mA
Time@Peak Reflow Temperature-Max (s) 40

Compare K6X1008C2D-PF55T00 with alternatives

Compare K6X1008C2D-PF550 with alternatives