K6X1008C2D-GF550
vs
CY62128BNLL-55SC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP32,.56
0.450 INCH, SOIC-32
Pin Count
32
32
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
Length
20.47 mm
20.4465 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP32,.56
SOP32,.56
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
2.997 mm
Standby Current-Max
0.00001 A
0.000015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.025 mA
0.02 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
11.43 mm
11.303 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare K6X1008C2D-GF550 with alternatives
Compare CY62128BNLL-55SC with alternatives