K6X1008C2D-BF550 vs CY62128BNLL-55SIT feature comparison

K6X1008C2D-BF550 Samsung Semiconductor

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CY62128BNLL-55SIT Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC ROCHESTER ELECTRONICS LLC
Part Package Code SOIC SOIC
Package Description SOP, SOP32,.56 0.450 INCH, SOIC-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G32
Length 20.47 mm 20.4465 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 2
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 3 mm 2.997 mm
Standby Current-Max 0.00001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 11.43 mm 11.303 mm
Base Number Matches 1 2
JESD-609 Code e0
Terminal Finish TIN LEAD

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