K6X0808C1D-GF700 vs M5M5256DFP-70XLT feature comparison

K6X0808C1D-GF700 Samsung Semiconductor

Buy Now Datasheet

M5M5256DFP-70XLT Mitsubishi Electric

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MITSUBISHI ELECTRIC CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP28,.45 SOP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Length 18.29 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP28,.45
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm
Standby Current-Max 0.00001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS MIXMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 8.38 mm
Base Number Matches 1 1
Number of Ports 1
Output Enable YES

Compare K6X0808C1D-GF700 with alternatives

Compare M5M5256DFP-70XLT with alternatives